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News
Workload-Driven HBF Substrate For Capacity-Scalable LLM Inference (Huawei, ETH Zurich, HUST)
1+ week, 6+ day ago (298+ words) Researchers at Huawei, ETH Zürich, and HUST published a technical paper titled “FLINT: Efficiently Leveraging High Bandwidth Flash for Capacity-Scalable LLM Inference Acceleration.” Abstract: “LLM inference is increasingly constrained by accelerator memory capacity rather than compute throughput. This constraint is…...
M3D 6T SRAM With BEOL Pass-Gates at 2nm (Georgia Tech, Synopsys)
2+ week, 1+ day ago (207+ words) Researchers from Georgia Institute of Technology and Synopsys published a technical paper titled “A Process-Aware Hybrid Si/IGO Monolithic-3D 6T SRAM with BEOL Pass-Gates for the 2nm Node.” Abstract Excerpt: The paper proposes “a monolithic-3D (M3D) 6T SRAM at the 2nm node” that integrates BEOL…...
How Will The Custom HBM Business Work?
3+ week, 4+ day ago (1776+ words) There is no one-size-fits-all — yet. With HBM4 comes the option of customizing the base die. Memory makers typically design all the layers of an HBM stack, but for a custom base die, who will design it? Who will manufacture it? And…...